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35um Electrodeposited Copper Foil , Flexible Printed Circuit ED Copper

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35um Electrodeposited Copper Foil , Flexible Printed Circuit ED Copper

Brand Name : JIMA

Model Number : EDCU-HC

Certification : SGS, ISO,Reach, RoHS

Place of Origin : china

MOQ : 100kg

Price : negotiation

Payment Terms : T/T, L/C

Supply Ability : 1000 Ton per month

Delivery Time : 5-15 days

Packaging Details : wooden carton

Purity : 99.95%

Foil profile : RA≤0.15μm,Rz≤1.7μm

Length Per Roll : 500 - 5000 Meter

Inter Diameter : 76 Mm,152 Mm, 3 Inch,6 Inch

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very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit.

Products Specifications.

1) Thickness Range: 0.035mm.

2) standard width:1290mm.

3) ID: 76 mm,152 mm.

4) Cu Content: 99.8%.

VLP ED Copper Foil Characteristics.

1. Zinc-free.

2. Excellent physics of high elongation Performance.

Products use:

- Flexible Printed Circuit.

- LED layer of HDI .

Difference between rolled copper foil and electrolytic copper foil.

Process is difference: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process).

Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.

RFQ:

Q1.what is the Internal diameter?

76/152/ custom.

Q2. Is it possible be zinc free copper foil?

Yes ,it is possible.

Q3. Is it the Fumigation carton box?

Yes ,it is .

Packaging & Delivery.

1. Packaging Details:wooden carton.

2. Delivery Detail:25-30days,depend on quantity.

Typical properties of VLP-S-B/R copper foil for FPC or inner layer of HDI.

Classification

Unit Requirement Test Method
Foil Designation / 1 H M 1 IPC-4562A
Nominal thickness / 10um 12um 1/2 OZ (18um) 3/4 OZ(25um) 1 OZ(35um) IPC-4562A
Area Weight g/㎡ 98±4 107±4 153±5 228±8 285±10

IPC-TM-650

2.2.12.2

Purity ≥99.8

IPC-TM-650

2.3.15

Foil Profile Shiny side(Ra) սm ≤2.5 ≤2.5 ≤2.5 ≤2.5 ≤2.5

IPC-TM-650

2.3.17

Matte side(Rz) um ≤2.5 ≤2.5 ≤2.5 ≤2.5 ≤2.5
Tensile Strength R.T.(23℃) Mpa ≥300 ≥300 ≥300 ≥300 ≥300

IPC-TM-650

2.3.18

H.T.(180℃) Mpa ≥200 ≥200 ≥200 ≥200 ≥200
Elongation R.T.(23℃) ≥4 ≥5 ≥6 ≥8 ≥10

IPC-TM-650

2.3.18

H.T.(180℃) ≥5 ≥6 ≥7 ≥8 ≥8
Peel Strength(FR-4) N/mm ≥0.8

IPC-TM-650

2.4.8

Ibs/in ≥4.6
Pinholes&porosity Number No

IPC-TM-650

2.1.2

Anti-oxidization R.T.(23℃) 180days /
H.T.(200℃) 60 Minutes /

Remark:Standard Width 1295mm,max width 1380(±1)mm,May according to the customer request tailor.We test the peel strength with PI ,please reconfirm with your pp.


Product Tags:

copper foil paper

      

hvlp copper foil

      
 35um Electrodeposited Copper Foil , Flexible Printed Circuit ED Copper Manufactures

35um Electrodeposited Copper Foil , Flexible Printed Circuit ED Copper Images

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